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Tenfell
Closed tender
Published 21 Feb 2024

UKRI-3441 Ball Bonder for Studding and Wire Bonding of Microelectronic Components

BIP SOLUTIONS LIMITED

Key facts

Estimated value
£1
Closing date
19 Jan 2024
Contract starts
09 Feb 2024
Contract ends
08 Feb 2025
Procedure
Open procedure (above threshold)
Buyer type
Other public body

Description

UK Research and Innovation's (UKRI) Science and Technology Facilities Council (STFC) wishes to establish a Contract for the provision of a Ball Bonder for Studding and Wire Bonding of Microelectronic Components.

Categories (CPV)

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