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Awarded contract
Published 05 Jan 2024

UKRI-3154 Indium deposition system

UK Research and Innovation · South West

Key facts

Contract value
£185,067
Awarded
20 Dec 2023
Contract starts
02 Jan 2024
Contract ends
01 Jan 2025
Procedure
Open procedure
Buyer type
Central government

Awarded to

SupplierValue
HHV Ltd£185,067

Description

STFC Interconnect provides a range of electronic and detector assembly techniques to scientific communities within STFC and our external collaborations. We have developed a process to perform surface preparation and make micro bumps of pure Indium metal, on a range of substrates including semiconductor wafers and semiconductor die.The resulting bumps are then used in our proprietary flip chip process to make many thousands or tens-of-thousands of electrical/mechanical connections in a single bonding step.The deposition process involves masking prior to deposition, then deposition, followed by removal of masked areas, leaving the desired bumps in place. Photo lithography (negative resist, lift-off) and shadow masking techniques are both used. We are now scaling this process into production and need new equipment capable of depositing on multiple substrates per day.

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