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Tenfell
Closed tender
Published 27 Sep 2023

UKRI-3154 Indium deposition system

UK Research and Innovation · South West

Key facts

Estimated value
£320,000
Closing date
02 Nov 2023
Contract starts
04 Dec 2023
Contract ends
03 Dec 2024
Procedure
Open procedure
Buyer type
Central government

Description

STFC Interconnect provides a range of electronic and detector assembly techniques to scientific communities within STFC and our external collaborations. We have developed a process to perform surface preparation and make micro bumps of pure Indium metal, on a range of substrates including semiconductor wafers and semiconductor die.The resulting bumps are then used in our proprietary flip chip process to make many thousands or tens-of-thousands of electrical/mechanical connections in a single bonding step.The deposition process involves masking prior to deposition, then deposition, followed by removal of masked areas, leaving the desired bumps in place. Photo lithography (negative resist, lift-off) and shadow masking techniques are both used. We are now scaling this process into production and need new equipment capable of depositing on multiple substrates per day.

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