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Tenfell
Awarded contract
Published 03 Jul 2024

NMIS Power Electronics Advanced Packaging Semiconductor Facility, dedicated die bonding, wire bonding, and encapsulation equipment.

University of Strathclyde · Scotland

Key facts

Contract value
£1,963,564
Awarded
24 Jun 2024
Procedure
Open procedure
Buyer type
Education

Awarded to

SupplierValue
Accelonix Ltd£1,963,564

Description

NMIS is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that is flexible to support a wide variety of power electronic semiconductor designs and packaging requirements. The initial focus will be procuring equipment to support die bonding, wire bonding and encapsulation and associated ancillaries required.

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Published by the buyer on Public Contracts Scotland (Open Government Licence v3.0). Always read the original notice before responding.