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Tenfell
Closed tender
Published 20 Dec 2018

Thermal Chuck and Chiller System

COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED · United Kingdom

Key facts

Estimated value
£80,000
Closing date
07 Jan 2019
Contract starts
25 Jan 2019
Contract ends
23 Jan 2022
Procedure
Open procedure (below threshold)
Buyer type
Other public body

Description

The Compound Semiconductor Applications Catapult is procuring a Thermal Chuck and Chiller System suitable for integration with a 200mm high power, semi-automated probe station.

The Catapult may also purchase additional related services.

Additional information: To express interest in this opportunity and receive the tender documents, please email [email protected] with ITC-2018-024 in the subject field.

Categories (CPV)

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About COMPOUND SEMICONDUCTOR APPLICATIONS CATAPULT LIMITED

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Published by the buyer on Contracts Finder archive (Open Contracting) (Open Government Licence v3.0). Always read the original notice before responding.