Skip to content
Tenfell
Closed tender
Published 19 Jun 2024

Supply, Delivery and Installation of wafer dicing kit for NMIS

University of Strathclyde · Scotland

Key facts

Estimated value
£1,000,000
Closing date
22 Jul 2024
Procedure
Open procedure
Buyer type
Education

Description

The National Manufacturing Institute Scotland is in the process of expanding its manufacturing capability into the semiconductor advanced packaging area with specific focus on power electronic semiconductors. To support this expansion, NMIS intends to procure equipment that can support a wide variety of power electronic semiconductor designs and packaging requirements. The concept design for the facility will support a publicly funded project which will see the creation of an advanced facility for developing and scaling-up packaging capabilities and includes provision of equipment that is sufficiently flexible to support a wide variety of power electronic semiconductor design and packaging requirements.

Categories (CPV)

Similar open tenders

About University of Strathclyde

Their tenders, awards, contracts coming up for renewal, decision makers and committee papers.

View buyer profile

Their other open tenders

Published by the buyer on Public Contracts Scotland (Open Government Licence v3.0). Always read the original notice before responding.